On May 19-20, 2018, the 3rd Consumer Packaging Experience Forum and PIF 2018 FMCG Packaging Innovation Summit Forum was held in Shanghai. Many FMCG industry brand manufacturers and packaging manufacturing companies appeared in the venue. They discussed the trends and future of the packaging industry with nearly 20 professors and doctors from Beijing Printing Institute, Tianjin University of Science and Technology, and many other universities.

On May 19-20, 2018, the 3rd Consumer Packaging Experience Forum and PIF 2018 FMCG Packaging Innovation Summit Forum was held in Shanghai. Many FMCG industry brand manufacturers and packaging manufacturing companies appeared in the venue. They discussed the trends and future of the packaging industry with nearly 20 professors and doctors from Beijing Printing Institute, Tianjin University of Science and Technology, and many other universities.

PIF Consumer Packaging Experience Forum and FMCG Packaging Innovation Summit Forum is a non-profit forum spontaneously formed by the industry. Provide intellectual support and direction guidance to provide guidance for supplier product technology development.

In this forum, participants focused on "the rise of the online economy and the transformation of e-commerce packaging", "return to the essence of retail and decrypt the packaging value chain under the Internet economy", "how to find innovations in paper packaging between safety, quality, experience and cost Balance? "," Design shocks, how can engineering accelerate the launch of innovative design "," How does packaging innovative design insight, stimulate and meet consumer demand "to discuss, interpret the cutting-edge packaging innovation direction and innovative technology new products at home and abroad, and the industry People have a common understanding of consumer demand and market trends.